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Surface Finishing Tutorial

#305 Plating on Ultrafine Powders

Category : Electroplating
August18, 2017

Plating consisting of copper, nickel, or silver can be directly applied on ultrafine particles (grain radius of roughly 10 um) that are made of iron, tungsten, mica, glass spheres, graphite, and alumina ceramics.

The applications include conductive metalized paste used for circuit formation on the ceramic boards, sintered alloy, IC packaging, electromagnetic shielding materials, anti-corrosive fillers, heat resistance enhancers, wear and sliding resistance materials, magnetic materials, and more.

Copper-plated & Silver-plated ultrafine ceramic powder

Sintered alloy products / Nickel-plated glass sphere cross-section

MISUMI USA eCatalog