Many characteristics can be expected for the Electroless Ni-P Alloy plate coating. The differences in the characteristics are based on the plating baths and conditions, but the diffferences can be made clear by classifying by the P contents in the coatings as shown in [Table 1]

[Table 1] Electroless Ni-P plating characteristics based on P contents

The low P type with P content of around 3% has hard coating and good alkali resistance. Since it has good adhesion to special material such as ITO, polyimides, and glass, therefore used on electronic components, valves, and composite plating, etc. The medium P type with P content of around 9% has been in long use, and this type often represents Electroless Nickel Plating when spoken of. With stable bath, it is characterized with fast precipitation, good adhesion, and good corrosion resistance. The high P type with P content of 12% or more is known for being used as base plating of hard disk substrates due to being non-magnetic. It is also used as the resistive material for ceramic resistors due to its low temperature coefficient of electrical resistance, as well as for acid resistant components. There are other electroless nickel platings with boron hydride compounds (Normally DMAB Dimethyl-amino-boron). Ni-B alloy platings do not easily form oxidation films on coating surfaces thus do not discolor when heat treated, has good solder adhesion, has very low electrical conductivity compared to Ni-P alloy plating. But since the baths are unstable and difficult to well manage and expensive, they are typically used on rather special purposes such as semiconductors and electronic components.