Let us give some thoughts to the conditions required to obtain desired plating thickness.

(4) Cathode current density settings

The cathode current density (A/dm2) to be applied will depend on experimental results. Normally in electroplating, glossiness, flatness, plating thickness, and cathode current efficiency in relation to cathode current density can be measured by Hull Cell Test, and the test results are applied to the plating bath to be used. Recommended values are typically provided by additive agent manufacturers.
For an example for glossy nickel plating bath, 2〜5A/dm² seems to be adopted.

(5) Plating thickness settings with variations in consideration

Suppose that a thickness of 10μm is required. Since the plating thickness will vary depending on the product shapes and energizing methods, the target thickness is 11μm which is 10% over (when the variation is small)

(6) Plating time settings

Again as the nickel plating as an example, based on the current density of 3A/dm2 since the plating speed is 0.205μm/minute at 1amp-minute/dm2, the time required to deposit 11μm plating can be obtained by the following formula.

【表1】各種金属めっき用諸係数

(7) Adjustment of plating time

All of the above is based on an ideal condition where the cathode current efficiency is at 100%. Some of the factors that may contribute on creating a less than ideal condition are non-uniform current flow on the anode or parts of the plated product due to poor energizing practices, and/or variances of anode surface area, bath temperature, bath composition, etc.
In any case, the amount of electricity determines the thickness of the plating, the most important point is to assure the uniform current flow. The above mentioned plating time is to be divided by cathode current efficiency to obtain the actual plating time.