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Surface Finishing Tutorial

#261 Bond Test Methods for Plating

Category : Electroplating
October14, 2016

(1)Description of the bond test methods

The test methods introduced here are available for measuring the adhesiveness of electroplating. Select an appropriate method according to the characteristics of plating films.

1)Cathode electrolysis test

Measure the adhesiveness of nickel/chrome plating on a steel substrate through electrolysis.

2)Push-out test

Create a hole (not a through-hole) from the back side of a plated surface. Use a stick to push it out. This method is for industrial chromium.

3)Ruled line test

Use a needle-like tool to scratch a sample surface. This test is appropriate for soft plating.

4)Grinding test (1.Grinding stone. 2. File)

Test the adhesion by grinding the plated surface using 1 and 2.

5)Chisel test

Insert a sharp chisel between the plated layer and substrate to measure the adhesiveness.

6)Thermal test (1. Heating test, 2. Thermal-shock test)

(To be described later.)

7)Barrel polishing test

Rotate the barrel with a steel ball and a plating sample in it. This method is not compatible with soft plating.

8)Peeling test (1. Tape test, 2. Solder test)

(To be described later.)

9)Tensile test
Apply a tensile stress to the sample until it fractures. Measure the adhesiveness by the degree of extensibility.

10)Bend test

(To be described later.)

11)Winding bend test

Wind a thin wire or a strip around the mandrel. (Mandrel test)

(2)Tape test

In this method, you will measure the adhesiveness by pasting an adhesive tape on a plated surface and peeling it off as quickly and hard as you can. It is suitable for relatively thin plating. This method is not appropriate for thick plating. You need to use tapes with the width of 12 to 19 mm defined in JIS Z 1522.
Before pasting a tape, leave a streak mark that reaches through the substrate as you draw a 2-mm square using a sharp knife to make the assessment more accurate.

(3)Bend test

This test measures the plating adhesiveness by bending a test sample. Use stakes with the bending radius of between 4 and 10 mm to secure the sample onto a vise. Repeat the process of bending the sample on the vise by 90 degrees back and forth. This method is not compatible if the plating thickness exceeds 2 mm.

(4)Thermal-shock test

This test measures the adhesiveness by a heat shock when the heated sample is rapidly cooled down. Heat up the sample in the furnace until it reaches to the temperature shown in [Table 1]. Then, remove the sample and quench it in room-temperature water.

[Table 1] Furnace and test temperature
Basis metal Plating metal
Chromium, nickel, copper, nickel-chromium, silver Tin, zinc, lead, cadmium, gold
Copper 250 150
Copper, copper alloy 250 150
Aluminum, aluminum alloy 200 150
Zinc alloy 150 150

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