General processes of photo electroforming consist of the following: production of the original drawing → production of the original plate → pretreatment of the base plate → photoresist application → lithographic exposure → development → baking → electroforming → mandrel separation → post-treatment (washing/drying)

The photo electroforming processes start with preparing an original drawing. After the process of creating an original plate by resizing and copying the drawing, you will create a positive or negative photomask called "master pattern". Then, apply photoresist on the base metal surface. Once it dries up, it becomes light sensitive.

Photoresist adheres to the master pattern. When exposed to light, the solubility changes by the action of light. A negative resist is the type of photoresist that the exposed portion becomes insoluble to the photoresist developer. On the other hand, a positive resist is the type of photoresist that the exposed portion becomes soluble to the photoresist developer.

Common photoresist hardens by light exposure and adheres to the substrate. When you develop it after this lithographic exposure, photoresist without electrodeposition will remain on the surface. In other words, photoresist is formed on the protected area (where no electrodeposition takes place).

If you use a metal substrate, you may need to use insulation tape or insulating paint for protecting the back surface and surrounding areas from electrodeposition of the metal. After this treatment, perform the resist separation treatment. Then, electrodeposit a layer of the specified thickness and remove the mandrel. [Fig.1] shows these processes.