(1)Method of adhesion test

JIS defines the following two methods of adhesion test of decorative electroplating applied over plastics:
1. Method of adhesion test, 2. Simplified method of adhesion test

(2)Method of adhesion test

This testing uses a tension tester to measure the adhesion strength of plating quantitatively when the plating film is peeled off from the substrate. This method is also known as the peeling test method.

1)Sample preparation

1. Cut off a sample from copper-plated components that are at least 50 µm thick. The area can be any size but must be free from distortion and must have consistent properties.   2. Use the components that are treated with heat at 80°C for one hour or those that had been plated over 48 hours ago.   3. As shown in [Fig.1], make a parallel incision (dotted lines) of approx.10 mm wide on the plating surface using a sharp knife.   4. Peel off the plating film for approx. 5 mm long roughly at 10 mm wide from the edge. Lift it up and peel off 20mm more using pliers.To reinforce the peeled-off portion, paste fiber-containing tape over it.

2)Test operation

(3)Simplified method of adhesion test

This test is a simplified method of measuring the adhesiveness when the plating is separated from the substrate using a spring balance. Using a spring balance having the minimum scale of 20 g, secure the sample on the balance and attach the fixture for the test sample as shown in [Fig.3]. Then, peel off the plating.Read the value when the plating is separated.