This standard defines the types of plating applied on copper and copper alloy substrates for decorative and anti-corrosion purposes, as well as the plating thickness of the significant surfaces and the corrosion-resistance properties.(The corrosion resistance properties are described in another section.)

[Table] Nickel and chrome plating on copper and copper alloy substrates

Cr mc: Microgram of microcracked chromium plating surface

This is a type of chrome plating containing evenly distributed micro-cracks, which are designed to distribute corrosion current and improve the anti-corrosion properties. This type of deposit can be formed by applying chromium plating over a special type of nickel plating on a nickel-plated substrate, or the same cracks can be generated over a thick layer of chromium plating.

Cr mp: Microgram of microporous chromium plating surface

This is a type of chrome plating containing evenly distributed tiny pores in its surface. The pores are designed to distribute corrosion current and improve the anti-corrosion properties. This type of deposit can be formed by applying chromium plating over nickel coating containing non-conductive fine particles, or by directly applying chromium coating containing non-conductive fine particles.