With some electronic component examples such as capacitors and LSI lead frames, the vital points of multiple pin simultaneous automated insertion will be explained.

(1) Examples of multiple pin simultaneous automated insertion

・For automated insertion of electronic components such as capacitors and LSIs, the components are fed from dedicated sticks (part holding carrier case with the parts inserted and aligned) or alignment trays.

・The pins of inserted components (LSI leads, etc.) are formed in dimensions within the specified tolerances for the holes where the pins are to be inserted. In case of LSI lead frames, the pins are formed to have 0°~10° angle spread in relation to the insertion holes.

・Before the insertion step, the pins are to be formed to match the hole locations in order not to cause deformations or vibrations to the PC boards.

・[Fig.1] is an example of forming multiple pins in specified dimensions for proper insertions with the automated insertion device gripper.

・After the insertion, some post insertion processes such as trimming and swaging (clinch processing) of the LSI leads may follow.