December 2015 Archives

#222 Plating Thickness Test by Electrolysis

| No Comments | No TrackBacks

(1) Measurement principle

Set the electrolysis equipment (measurement head) on the plating surface. Pour the electrolyte and polarize a specified area of the plating surface. Electrolysis at constant current dissolves the plating. In this method, the plating thickness is measured by the electricity consumed for this process. The amount of metal dissolution (plating thickness) is proportionate to the time in the constant current dissolution. Therefore, the time required for electrolysis represents the plating thickness.

(2) Equipment

The measurement equipment is comprised of the constant DC current supply unit, electrolytic head (consisting of an electrolytic bath, a stirring device, retainers, etc.), and measuring unit.
In order to prevent liquid spill and to keep the electrolysis area constant, a gasket is installed at the bottom end where the plating surface contacts the electrolytic bath. A gasket for the 0.2cm2 area of electrolysis is generally used.
Since the electrochemical equivalent varies by the type of the plating metal, it is possible to select a constant current value unique to each metal.

Figure

(3) Electrolyte

1. Because this test utilizes electrochemical reaction, you need to use an electrolyte that does not corrode the plating films while they are not energized.
2. The anode current efficiency should be 100% for anode electrolytic treatments of plating surface.
3. When a substrate is exposed after dissolution of its plating film (this phenomenon is referred to as "end point"), a significant change in electrolysis voltage must be observed.
4. None of the electrolyte meets the above-mentioned conditions for all types of metals. For this reason, many types of electrolyte have been developed. It is important to choose an appropriate type of electrolyte according to the plating metal and substrate or by the combination of upper and lower plating metals for multi-layered plating.

#221 Plating Thickness Test by Microscopic Exam of Cross Section

| No Comments | No TrackBacks

This is a method using a microscope to measure the plating thickness by enlarging the vertical section of a plating layer. The sample used for observing the vertical section is referred to as a cross-section sample, which can be prepared in the steps described below.

(1) Preparation of a cross-section sample

1. Cut out a sample of approximately 10 mm x 10 mm square from the significant surface of the plated product. Gently remove the burr.
2. After cutting out the sample, clean it with solution such as organic solvents to remove oil content and dirt.
3. Place the sample in a metallic or plastic mold so that the significant surface faces in the vertical direction. Then, harden it with resin (by room temperature setting or thermosetting). In general, the finished size will be approximately 25⌀ or 30⌀ x 23 mm.This is called potting compound.
4. Use a dedicated grinding machine to polish the sample surface by splashing a small amount of water. Start with the coarse abrasive grains. Use #1000 or #1200 for final polishing. In addition, use abrasive agent such as alumina to polish more (buffing) for mirror finish.
5. If necessary, use etching solution and corrode the plating layer or substrate to make the interlayer areas more optically visible. The methods include corroding the plating layer or the substrate.

(2) Measurement

1. To keep the polishing surface of the sample perpendicular to the optical axis of the microscope, use a dedicated press machine together with rubber clay for "centering" work.
2. Observe the sample by a metallographic microscope or a micro Vickers hardness meter and measure the plating thickness.
(Note) It is necessary to implement a measure to prevent sagging of soft plating during polishing work.

Figure

月別 Archives

Pages

Powered by Movable Type 6.0.3

About this Archive

This page is an archive of entries from December 2015 listed from newest to oldest.

November 2015 is the previous archive.

January 2016 is the next archive.

Find recent content on the main index or look in the archives to find all content.