September 2017 Archives

This standard defines the types of plating applied on copper and copper alloy substrates for decorative and anti-corrosion purposes, as well as the plating thickness of the significant surfaces and the corrosion-resistance properties.(The corrosion resistance properties are described in another section.)

[Table] Nickel and chrome plating on copper and copper alloy substrates
Grade Base-coat plating Minimum plating thickness (µm) of base-coat plating Top-coat plating Minimum plating thickness (µm) of top-coat plating Symbol
(Note)
Nib:Bright nickel plating
Nid:Duplex nickel plating
Cr r:Regular chrome plating
Cr mc:Microcracked chromium plating
Cr mp:Microporous chromium plating
Grade 1Nib2Cr r0.1EP-Cu/Ni 2 b, Cr 0.1 r
or
EP-Cu/Nib, Cr r [1]
Grade 2Nib5Cr r0.1EP-Cu/Ni 5 b, Cr 0.1 r
or
EP-Cu/Nib, Cr r [2]
Grade 3Nib10Cr r0.1EP-Cu/Ni 10 b, Cr 0.1 r
or
EP-Cu/Nib, Cr r [3]
Grade 4Nib25Cr r0.1EP-Cu/Ni 25 b, Cr 0.1 r
or
EP-Cu/Nib, Cr r [4]
Grade 5Nid30Cr r0.1EP-Cu/Ni 30 d, Cr 0.1 r
or
EP-Cu/Nid, Cr r [5]
Nid25Cr mc0.1EP-Cu/Ni 25 d, Cr 0.1 mc
or
EP-Cu/Nid, Cr mc [5]
Nid25Cr mp0.1EP-Cu/Ni 25 d, Cr 0.1 mp
or
EP-Cu/Nid, Cr mp [5]

* The plating thickness of duplex nickel plating will be determined and agreed between the parties concerned.

Cr mc: Microgram of microcracked chromium plating surface
This is a type of chrome plating containing evenly distributed micro-cracks, which are designed to distribute corrosion current and improve the anti-corrosion properties.
This type of deposit can be formed by applying chromium plating over a special type of nickel plating on a nickel-plated substrate, or the same cracks can be generated over a thick layer of chromium plating.
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Cr mp: Microgram of microporous chromium plating surface
This is a type of chrome plating containing evenly distributed tiny pores in its surface. The pores are designed to distribute corrosion current and improve the anti-corrosion properties.
This type of deposit can be formed by applying chromium plating over nickel coating containing non-conductive fine particles, or by directly applying chromium coating containing non-conductive fine particles.
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This standard defines the types of plating applied on steel substrates for decorative and anti-corrosion purposes, as well as the plating thickness of the significant surfaces and the corrosion-resistance properties. (The corrosion resistance properties are described in another section.)

[Table] Copper, nickel, and chrome plating applied on steel substrates
Grade Base-coat plating Base-coat plating
Minimum thickness (µm)
Top-coat plating Top-coat plating
Minimum thickness (µm)
Dark blue
(Note)
Nib: Bright nickel plating
Nid: Duplex nickel plating
Cr r: Regular chrome plating
Cr mc: Microcracked chromium plating
Cr mp: Microporous chromium plating
Grade 1 Cu, Nib 3 Cr r 0.1 EP-Fe/Cu+Nib 3,Cr 0.1r
or
Ep-Fe/Cu+Nib, Cr r [1]
Grade 2 Cu, Nib 5 Cr r 0.1 EP-Fe/Cu+Nib 5,Cr 0.1r
or
Ep-Fe/Cu+Nib, Cr r[2]
Grade 3 Cu, Nib 10 Cr r 0.1 EP-Fe/Cu+Nib 10,Cr0.1r
or
Ep-Fe/Cu+Nib, Cr r[3]
Grade 4 Cu, Nib 15 Cr r 0.1 EP-Fe/Cu+Nib 15,Cr0.1r
or
Ep-Fe/Cu+Nib, Cr r[4]
Grade 5 Cu, Nib 25 Cr r 0.1 EP-Fe/Cu+Nib 25,Cr 0.1r
or
Ep-Fe/Cu+Nib, Cr r[5]
Grade 6 Cu, Nib 30 Cr r 0.1 EP-Fe/Cu+Nib 30,Cr0.1r
or
Ep-Fe/Cu+Nib, Cr r[6]
Grade 7 Cu, Nib 30 Cr mc 0.1 EP-Fe/Cu+Nib30,Cr0.1mc
or
Ep-Fe/Cu+Nib, Cr mc [7]
Cu, Nib 30 Cr mp 0.1 EP-Fe/Cu+Nib30, Cr0.1mp
or
Ep-Fe/Cu+Nib, Cr mp [7]
Grade 8 Cu, Nib 50 Cr r 0.1 EP-Fe/Cu+Nib 50, Cr 0.1 r
or
Ep-Fe/Cu+Nib, Cr r [8]
Cu, Nid 35 Cr mc 0.1 EP-Fe/Cu+Nid 35, Cr 0.1mc
or
Ep-Fe/Cu+Nid, Cr mc [8]
Cu, Nid 35 Cr mp 0.1 EP-Fe/Cu+Nid 35, Cr0.1mp
or
Ep-Fe/Cu+Nid, Cr mp[8]
Grade 9 Cu, Nid 50 Cr r 0.1 EP-Fe/Cu+Nid 50,Cr0.1 r
or
Ep-Fe/Cu+Nid, Cr r [9]
Cu, Nid 45 Cr mc 0.1 EP-Fe/Cu+Nid 45,Cr0.1 mc
or
Ep-Fe/Cu+Nid, Cr mc [9]
Cu, Nid 45 Cr mp 0.1 EP-Fe/Cu+Nid 45,Cr0.1 mp
or
Ep-Fe/Cu+Nid, Cr mp [9]

* The plating thickness of copper, nickel, and duplex nickel plating will be determined and agreed between the parties concerned.

#309 Graphical Symbol for Electroplated Coating

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According to JIS, the electroplating and electroless plating specifications must be indicated in the following classifications and orders:

image

(1)Note 2) Symbol for plating method

EP: Electroplating, ELP: Electroless plating

(2)Note 3) Hyphen

(3)Symbol for substrate material

Fe: Steel, Cu: Copper and Copper Alloy, Zn: Zinc Alloy, AL: Aluminum and Aluminum Alloy, Mg: Magnesium Alloy, PL: Plastics, CE: Ceramics

(4)Note 4) Slash

(5)Symbol for plating material

Ni: Nickel, Cr: Chrome, Cu: Copper, Zn: Zinc, Au: Gold, Ag: Silver, Sn: Tin, Crr: Regular Chrome, ICr: Industrial Chrome

Note 5)For multilayer plating, the plating material compositions are specified from left to right, in the order closest to the substrate, and are separated with a comma.If both electroplating and electroless plating were used, the corresponding symbol followed by a hyphen is added before the plating material symbol.
Example 4 in the previous volume) EP-Fe/ELP-Ni 15, ICr 20

(6)Symbol for plating thickness

The unit is um (micrometer). e.g. 0.1, 5, 10, 20, 40

(7)Symbol for plating type

b: Bright plating, s: Semi-bright plating, d: Duplex plating, t: Three-layer plating, v: Fine matte plating, n: Non-smooth plating, m: Dull plating, cp: Composite plating, bk: Black plating, r: Regular plating, mp: Microporous plating, mc: Microcracked plating, cf: Crack-free plating

(8)Symbol for post-treatment

CM1: Bright chromate, CM2: Colored chromate, HB: hydrogen-removal baking, DH: Diffusion treatment, PA: Painting, CL: Coloring, AT: Anti-tarnish treatment

(9)Note 6) Colon

(10)Symbol for operating environment

A:Highly corrosive outdoor environment (e.g. coastal areas and industrial zones)
B:Normal outdoor environment (e.g. rural zones and residential areas)
C:Highly humid indoor environment (e.g. bathrooms and kitchens)
D:Normal indoor environment (e.g. inside of houses and offices)

#308 Coloring and Plating

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Each plating film has a color specific to the metal or the alloy that is based on. To produce more variations of colors, metal coloring or paint application can be adopted.

(1) Chemical conversion treatment and plating

Vivid blue or red colors can be added to galvanized products directly by immersing them into a special coloring solution.
One of the established methods of enhancing the metal feel of nickel or silver plating is to immerse the metal substrate into a special sulfide solution until chemical coating films are formed over it. Unique color tones can be also produced as the time of immersion increases. The color changes from pale gold -> gold -> red gold -> wine color -> blue purple -> navy blue.
The scope of application has been expanding, as it is easy to process, colors are easily controlled and free from irregularities. To improve the durability, clear coating is applied at the end of the coloring process.
image

(2) Paint application and plating

(1) Galvanizing and black electrodeposition coating
For automotive parts and electronic device components requiring exceptional durability and black color tones, the black electrodeposition coating (film thickness is between 10 - 20 µm) is not sufficient to obtain the required durability. Therefore, the black cation electrodeposition coating must be applied after galvanizing. image

(2) Decorative electrodeposition coating
Applying chromatic cation electrodeposition coating over achromatic plating films, such as nickel plating, will add colors to the plated goods. image

* What is "electrodeposition coating"?
DC electrolysis on a product that is immersed in an electrolysis tank containing aqueous paint dissolved in water will cause the ionized paint components to be deposited on the product surface, forming a paint film. When the paint component acts as a negative ion, it is referred to as the anion electrodeposition coating. When it acts as a positive ion, it is called the cation electrodeposition coating. Using the cation electrodeposition makes the product serve as a cathode and does not cause plating films to be dissolved.

#307 Print and Electroplating

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Printed wiring boards, which are the essential item for electrical devices and communication equipment, are the typical example of products made by printing and plating work combined.An original plate of a print wiring board is a plastic sheet totally covered with a copper foil. To form a desired electrical circuit using this copper foil, the screen with the circuit pattern laid out must be prepared so that the resist can be printed on this foil.

Unnecessary copper foil needs to be removed by the etching process. To increase the electrical capacity, copper plating should also be applied on the circuit.If necessary, tin plating, solder plating, nickel plating, or gold plating can also be applied.

One of the common conventional methods of adding decorative finish to the interior, personal ornaments and furniture is to print the engraved resist pattern from the metal surfaces through etching while protecting the substrate where needed. Nowadays, this conventional method combined with different forms of electroplating, such as dispersal plating, electroforming, and paint application is used to create contemporary and stylish products.
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