Soldering is to fuse joint molten solder onto surfaces of base substrates. However, since this jointing is not for structural strength, but to create joints with low electrical resistance with high reliability, much sophistication in production technology based on relevant knowledge in many academic disciplines.
(1) Three elements of soldering related construction materials
As shown in [Fig.1], optimal soldering is obtained with a relationship of the three materials. Therefore, the soldering technology will need to establish an optimum system with these material characteristics.

(2) Soldering technology and production technology
| - | Solder mounting process methods of electronic components are broadly divided as shown in [Fig.2] |

| - | The Insert mounting methods are used more decreasingly in response to the trends in product size and weight reduction. |
| - | Automating becomes easier as the board and circuit designs are made to use only one of the process methods in [Fig.2] (i.e. Surface mount only). |
| - | The following technological disciplines are related to soldering techniques. |





![[Fig.1] Gate shape and applicable workpiece shape (Right) [Fig.1] Gate shape and applicable workpiece shape (Right)](http://www.misumi-techcentral.com/tt/en/lca/images/156_02.gif)





